Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
100-008-001

100-008-001

CONN IC DIP SOCKET 8POS GOLD

3M

2,861 0.00

RFQ

100-008-001

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-010-000

100-010-000

CONN IC DIP SOCKET 10POS GOLD

3M

2,538 0.00

RFQ

100-010-000

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-000

100-014-000

CONN IC DIP SOCKET 14POS GOLD

3M

2,108 0.00

RFQ

100-014-000

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-014-001

100-014-001

CONN IC DIP SOCKET 14POS GOLD

3M

2,927 0.00

RFQ

100-014-001

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-016-000

100-016-000

CONN IC DIP SOCKET 16POS GOLD

3M

2,309 0.00

RFQ

100-016-000

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-016-001

100-016-001

CONN IC DIP SOCKET 16POS GOLD

3M

2,765 0.00

RFQ

100-016-001

Datasheet

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-018-000

100-018-000

CONN IC DIP SOCKET 18POS GOLD

3M

2,897 0.00

RFQ

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-018-001

100-018-001

CONN IC DIP SOCKET 18POS GOLD

3M

2,191 0.00

RFQ

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-020-000

100-020-000

CONN IC DIP SOCKET 20POS GOLD

3M

2,265 0.00

RFQ

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-020-001

100-020-001

CONN IC DIP SOCKET 20POS GOLD

3M

2,751 0.00

RFQ

Bulk 100 Obsolete DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-022-000

100-022-000

CONN IC DIP SOCKET 22POS GOLD

3M

2,959 0.00

RFQ

Bulk 100 Obsolete DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-024-000

100-024-000

CONN IC DIP SOCKET 24POS GOLD

3M

2,541 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-024-001

100-024-001

CONN IC DIP SOCKET 24POS GOLD

3M

3,830 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-028-000

100-028-000

CONN IC DIP SOCKET 28POS GOLD

3M

3,528 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-028-001

100-028-001

CONN IC DIP SOCKET 28POS GOLD

3M

2,149 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-032-000

100-032-000

CONN IC DIP SOCKET 32POS GOLD

3M

2,162 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-032-001

100-032-001

CONN IC DIP SOCKET 32POS GOLD

3M

2,363 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-040-000

100-040-000

CONN IC DIP SOCKET 40POS GOLD

3M

3,329 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-040-001

100-040-001

CONN IC DIP SOCKET 40POS GOLD

3M

3,558 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Closed Frame, Seal Tape Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
100-042-000

100-042-000

CONN IC DIP SOCKET 42POS GOLD

3M

3,799 0.00

RFQ

Bulk 100 Obsolete DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold Flash Brass Polyphenylene Sulfide (PPS), Glass Filled
Total 338 Records«Prev1... 56789101112...17Next»
1500+
Help you to save your cost and time.
20,000.000
Reliable package for your goods.
1800+
Fast reliable delivery to save time.
15,000+
Quality premium after-sale service.
EASTLEAP Electronics

HOME

EASTLEAP Electronics

PRODUCT

EASTLEAP Electronics

PHONE

EASTLEAP Electronics

USER

EASTLEAP ElectronicsOnline