Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
36-6575-10

36-6575-10

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,195 19.23

RFQ

36-6575-10

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3551-10

44-3551-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3,994 19.25

RFQ

44-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3552-10

44-3552-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3,894 19.25

RFQ

44-3552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3553-10

44-3553-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3,485 19.25

RFQ

44-3553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6551-10

44-6551-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

3,743 19.25

RFQ

44-6551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-6552-10

44-6552-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

2,260 19.25

RFQ

44-6552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
23-0508-21

23-0508-21

CONN SOCKET SIP 23POS GOLD

Aries Electronics

2,073 19.26

RFQ

23-0508-21

Datasheet

Bulk 508 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
23-0508-31

23-0508-31

CONN SOCKET SIP 23POS GOLD

Aries Electronics

3,585 19.26

RFQ

23-0508-31

Datasheet

Bulk 508 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
40-6556-11

40-6556-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,703 19.26

RFQ

40-6556-11

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
180-PGM18006-10

180-PGM18006-10

PIN GRID ARRAY SOCKET 180PIN

Aries Electronics

3,222 19.30

RFQ

- PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-0501-21

30-0501-21

CONN SOCKET SIP 30POS GOLD

Aries Electronics

2,337 19.32

RFQ

30-0501-21

Datasheet

Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-0501-31

30-0501-31

CONN SOCKET SIP 30POS GOLD

Aries Electronics

3,380 19.32

RFQ

30-0501-31

Datasheet

Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
39-0501-20

39-0501-20

CONN SOCKET SIP 39POS TIN

Aries Electronics

3,886 19.32

RFQ

39-0501-20

Datasheet

Bulk 501 Active SIP 39 (1 x 39) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
39-0501-30

39-0501-30

CONN SOCKET SIP 39POS TIN

Aries Electronics

3,293 19.32

RFQ

39-0501-30

Datasheet

Bulk 501 Active SIP 39 (1 x 39) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-211

20-3508-211

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,804 19.32

RFQ

20-3508-211

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3508-311

20-3508-311

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,141 19.32

RFQ

20-3508-311

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6621-30

24-6621-30

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

2,292 19.32

RFQ

24-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-3551-10

40-3551-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3,040 19.32

RFQ

40-3551-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3552-10

40-3552-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2,322 19.32

RFQ

40-3552-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3553-10

40-3553-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2,489 19.32

RFQ

40-3553-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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