Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
42-3554-10

42-3554-10

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2,829 20.91

RFQ

42-3554-10

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
30-81250-610C

30-81250-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,460 20.91

RFQ

30-81250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8563-610C

30-8563-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

3,013 20.91

RFQ

30-8563-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8940-310C

30-8940-310C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,687 20.91

RFQ

30-8940-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-8950-610C

30-8950-610C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,397 20.91

RFQ

30-8950-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
25-0511-11

25-0511-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2,828 20.93

RFQ

25-0511-11

Datasheet

Bulk 511 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-0511-11

24-0511-11

CONN SOCKET SIP 24POS GOLD

Aries Electronics

3,856 20.93

RFQ

24-0511-11

Datasheet

Bulk 511 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-71000-10

35-71000-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2,042 20.96

RFQ

35-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
35-7360-10

35-7360-10

CONN SOCKET SIP 35POS TIN

Aries Electronics

2,590 20.96

RFQ

35-7360-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 35 (1 x 35) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-823-90C

40-823-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,827 20.96

RFQ

40-823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-820-90C

40-820-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,587 20.98

RFQ

40-820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-822-90C

40-822-90C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,929 20.98

RFQ

40-822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-6574-11

24-6574-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

2,886 20.98

RFQ

24-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6571-11

24-6571-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,642 20.98

RFQ

24-6571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3571-11

24-3571-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,551 20.98

RFQ

24-3571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3572-11

24-3572-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,830 20.98

RFQ

24-3572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3573-11

24-3573-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,495 20.98

RFQ

24-3573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3574-11

24-3574-11

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

3,985 20.98

RFQ

24-3574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6572-11

24-6572-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,443 20.98

RFQ

24-6572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6570-11

24-6570-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics

2,258 20.98

RFQ

24-6570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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