Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6508-21

28-6508-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,168 32.57

RFQ

28-6508-21

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6508-31

28-6508-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,939 32.57

RFQ

28-6508-31

Datasheet

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
48-3551-11

48-3551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,101 32.61

RFQ

48-3551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3552-11

48-3552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,101 32.61

RFQ

48-3552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3553-11

48-3553-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,203 32.61

RFQ

48-3553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6551-11

48-6551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,710 32.61

RFQ

48-6551-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6552-11

48-6552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,940 32.61

RFQ

48-6552-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6553-11

48-6553-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

2,573 32.61

RFQ

48-6553-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3554-11

48-3554-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

3,043 32.61

RFQ

48-3554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
120-PGM13015-40

120-PGM13015-40

CONN SOCKET PGA GOLD

Aries Electronics

3,783 32.70

RFQ

120-PGM13015-40

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-21

28-3508-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

2,936 33.17

RFQ

28-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-31

28-3508-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,131 33.17

RFQ

28-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
42-6556-31

42-6556-31

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2,849 33.22

RFQ

42-6556-31

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
42-6556-21

42-6556-21

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

2,852 33.22

RFQ

42-6556-21

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
40-6574-11

40-6574-11

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3,829 33.33

RFQ

40-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3574-11

40-3574-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,935 33.33

RFQ

40-3574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-6573-11

40-6573-11

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

2,187 33.33

RFQ

40-6573-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3570-11

40-3570-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,133 33.33

RFQ

40-3570-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3571-11

40-3571-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,102 33.33

RFQ

40-3571-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-3572-11

40-3572-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

2,110 33.33

RFQ

40-3572-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 4324 Records«Prev1... 170171172173174175176177...217Next»
1500+
Help you to save your cost and time.
20,000.000
Reliable package for your goods.
1800+
Fast reliable delivery to save time.
15,000+
Quality premium after-sale service.
EASTLEAP Electronics

HOME

EASTLEAP Electronics

PRODUCT

EASTLEAP Electronics

PHONE

EASTLEAP Electronics

USER

EASTLEAP ElectronicsOnline