Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Availability Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
114-87-316-41-134161

114-87-316-41-134161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

3,378 1.29

RFQ

114-87-316-41-134161

Datasheet

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
D2820-42

D2820-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

2,815 2.40

RFQ

D2820-42

Datasheet

Tube D2 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
110-44-324-41-001000

110-44-324-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

3,939 1.42

RFQ

110-44-324-41-001000

Datasheet

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
10-0518-10

10-0518-10

CONN SOCKET SIP 10POS GOLD

Aries Electronics

1,574 1.61

RFQ

10-0518-10

Datasheet

Bulk 518 Active SIP 10 (1 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
D2814-42

D2814-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

1,186 1.68

RFQ

D2814-42

Datasheet

Tube D2 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 196.9µin (5.00µm) Brass Plastic
08-2513-10

08-2513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

158 1.85

RFQ

08-2513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
917-47-210-41-005000

917-47-210-41-005000

CONN SOCKET TRANSIST TO-5 10POS

Mill-Max Manufacturing Corp.

442 1.90

RFQ

917-47-210-41-005000

Datasheet

Tube 917 Active Transistor, TO-100 10 (Round) - Gold Flash Beryllium Copper Through Hole Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
ICO-314-SGT

ICO-314-SGT

CONN IC DIP SKT 14POS

Samtec Inc.

3,253 3.79

RFQ

ICO-314-SGT

Datasheet

Tube ICO Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polyester, Glass Filled
AR 28-HZW/TN

AR 28-HZW/TN

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

2,448 4.76

RFQ

AR 28-HZW/TN

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester
20-0511-10

20-0511-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

2,482 6.50

RFQ

20-0511-10

Datasheet

Bulk 511 Active SIP 20 (1 x 20) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
299-43-310-11-001000

299-43-310-11-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

290 4.34

RFQ

299-43-310-11-001000

Datasheet

Tube 299 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
TCC05DCSN-S1403

TCC05DCSN-S1403

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions

3,473 15.44

RFQ

TCC05DCSN-S1403

Datasheet

Tray - Active Transistor, TO-220 and TO-247 5 (Rectangular) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyphenylene Sulfide (PPS)
40-6554-11

40-6554-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

3,066 27.86

RFQ

40-6554-11

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
214-7390-55-1902

214-7390-55-1902

CONN SOCKET SOIC 14POS GOLD

3M

3,941 34.27

RFQ

214-7390-55-1902

Datasheet

Bulk Textool™ Active SOIC 14 (2 x 7) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
216-7383-55-1902

216-7383-55-1902

CONN SOCKET SOIC 16POS GOLD

3M

3,884 37.47

RFQ

216-7383-55-1902

Datasheet

Bulk Textool™ Active SOIC 16 (2 x 8) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polyethersulfone (PES), Glass Filled
280-5205-01

280-5205-01

CONN SOCKET QFN 80POS GOLD

3M

2,668 150.66

RFQ

280-5205-01

Datasheet

Bulk Textool™ Active QFN 80 (4 x 20) 0.020 (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020 (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES)
232-1287-00-0602J

232-1287-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M

2,451 39.22

RFQ

232-1287-00-0602J

Datasheet

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
240-1288-00-0602J

240-1288-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M

2,222 46.21

RFQ

240-1288-00-0602J

Datasheet

Tube Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
A 24-LC-TR

A 24-LC-TR

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

3,608 0.46

RFQ

A 24-LC-TR

Datasheet

Tube - Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT)
06-0518-10

06-0518-10

CONN SOCKET SIP 6POS GOLD

Aries Electronics

3,343 1.00

RFQ

06-0518-10

Datasheet

Bulk 518 Active SIP 6 (1 x 6) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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